These heat sinks offer high design flexibility and you can achieve high fin density.
Most efficient heat sink design.
3 skived heat sinks.
For over a decade these parts have offered an alternative to the limitations of the extrusion process.
Analysis demonstrated that the design with heat pipes running above the components kept junction temperatures within 2 c of the original.
In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.
To efficiently move thermal energy away from a heat generating component the heat sink must have high thermal conductivity.
Currently fins are used extensively and rods are also available however are more expensive.
Heat sinks produced through this method are normally made from copper.
Increases in cooling surface area of 200 to 300 allow significant decreases in heat sink volume.
They are produced from a solid block of metal.
A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.
Bonded fin heat sinks generally offer moderate performance and come at a high cost.
Some of the more common construction materials for heat sinks are aluminum and copper.
One of the most critical parameters of a heat sink is the material from which it is constructed.
One with heat pipes that stopped at the edge of the components and the other with heat pipes that ran above the components.
These designs are designed for thermal efficiency but contained by manufacturing process.
Bonded fin heat sinks use separate base and fins assembled to form a heat sink figure 3.